NAME: | High-Speed Connector & Storage 8GB EMMC, 64MB QSPI FLASH Developer Kit Carrier Board | Keyword: | High-Speed Connector & Storage 8GB EMMC, 64MB QSPI FLASH Developer Kit Carrier Board |
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Chip Level: | Industrial Grade | Chip CPU: | Mali™-400 MP2 GPU |
FLASH Storage: | 8GB EMMC FLASH, 64MB QSPI FLASH | LED: | 1 LED In The Core Board, 4 LEDs In The Carrier Board |
Chip Working Temperature: | -40℃~85℃ | Voltage Input: | +12V DC |
Keys: | 1 Reset KEY, 2 User KEYs | Current Input: | Max. Current 3A |
High Light: | high speed connector fpga development kit,8gb emmc fpga development kit |
High-Speed Connector & Storage 8GB eMMC, 64MB QSPI FLASH Developer Kit Carrier Board
FPGA Development Developer Kit Introduction
The AXU9EGB carrier board expands its rich peripheral interface,including 1 M.2 interface, 1 DP output interface, 4 USB 3.0 Interface, 2GigabitEthernet interfaces, 2 SFP Interfaces, 2 SATA Interfaces, 2 UART, 1SDcardslot, 1 FMC Interface, 2-Channel CAN bus interfaces, 2-Channel RS485businterfaces, 1 MIPI Camera Interface, 40-pin expansion ports andsomekeysand LEDs.In order to connect with the carrier board, the four board-to-boardconnectors of this core board expand the PS side USB2.0 interface, GigabitEthernet interface, SD card interface and other remaining MIOports; alsoexpand 4 pairs of PS MGT high-speed transceiver interface; and16GTHtransceivers and almost all IO ports on the PL side (HP I/O: 96, HDI/O: 84).The wiring between the XCZU9EG chip and the interface has beenprocessedwith equal length and differential, and the core board size is only3.15*2.36(inch), which is very suitable for secondary development.
FPGA Development Developer Kit
Core Board SOM | ACU9EG |
FPGA Chip | XCZU9EG-2FFVB1156I |
Chip CPU | 4x ARM Cortex-A53, 1.333GHz,2x Cortex™-R5, 533MHz |
Chip GPU | Mali™-400 MP2 |
Core Board RAM | 4GB PS DDR4, 64bit, 2400Mbps 2GB PL DDR4, 32bit, 2400Mbps |
PS end High Speed Connector | PCIe Gen2 x4, 2x USB3.0, SATA 3.1,DisplayPort, 4x Tri-mode Gigabit Ether net |
PS end General Connector | 2x USB 2.0, 2x SD/SDIO, 2x UART, 2x CAN 2.0B, 2x I2C, 2x SPI, 4x 32b GPIO |
HP I/O | 96 |
HD I/O | 66 |
Chip Working Temperature | -40℃~85℃ |
Gigabit Ethernet | Two 10/100/1000M Ethernet with RJ-45 Interfaces for Data Exchange |
Look-up-tables (LUTs) | 274k |
DSP Slices | 2520 |
EMMC FLASH | 8GB, Used as Large-Capacity Storage System |
Power Supply Parameters
Voltage Input | +12V DC |
The SSD in the picture is only for display and needs to be purchased separately